Mag-layers-usa MSCDRI-2D14S Manuale Utente Scaricare il pdf (Pagina 3)

(4) RELIABILITY TEST METHOD

MECHANICAL

TEST ITEM SPECIFICATION TEST DETAILS

Substrate bending

△L/Lo≦±5%

The sample shall be soldered onto the printed circuit board

in figure 1 and a load applied unitil the figure in the arrow

There shall be direction is made approximately 3mm.(keep time 30 seconds)

no mechanical PCB dimension shall the page 7/9

damage or elec- F(Pressurization)

trical damege.

Vibration

△L/Lo≦±5%

The sample shall be soldered onto the printed circuit board

and when a vibration having an amplitude of 1.52mm

There shall be and a frequency of from 10 to 55Hz/1 minute repeated should

no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each.

damage. (A total of 6 hours)

Solderability

New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated

More than 90% over the whole of the sample before hard, the sample shall

then be preheated for about 2 minutes in a temperature of

130～150℃ and after it has been immersed to a depth 0.5mm

below for 3±0.2 seconds fully in molten solder M705 with

a temperature of 245±5℃.

More than 90% of the electrode sections shall be couered

with new solder smoothly when the sample is taken out of

the solder bath.

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MSCDRI-2D14S-SERIES

MAG.LAYERS

PRESSURE ROD

figure-1

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Mag-layers-usa MSCDRI-2D14S Manuale Utente Pagina 3